DocumentCode
3193741
Title
A model for interlevel coupling noise in multilevel interconnect structures
Author
Saint-Laurent, Martin ; Ajmal, Zakaria ; Swaminathan, Madhavan ; Meindl, James D.
Author_Institution
Intel Corp., Austin, TX, USA
fYear
2001
fDate
6-6 June 2001
Firstpage
110
Lastpage
112
Abstract
In multilevel interconnect structures, the interconnect layers are practically always perpendicular to each other. Because of the capacitive coupling between adjacent layers, the switching activity in one layer produces noise in the other. This paper analyses the interlevel coupling noise present at the far end of a victim line when a large number of perpendicular attackers are randomly switching. Each attacker is modeled as a Markov chain and the victim is modeled as an RLC transmission line. The result is a novel closed-form expression for the power spectral density of the interlevel coupling noise.
Keywords
Markov processes; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; Markov chain; RLC transmission line; adjacent layers; capacitive coupling; closed-form expression; interlevel coupling noise; multilevel interconnect structures; perpendicular attackers; power spectral density; randomly switching attackers; switching activity; Capacitance; Clocks; Closed-form solution; Conductors; Couplings; Crosstalk; Inductance; Integrated circuit interconnections; Power transmission lines; Transfer functions;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
Conference_Location
Burlingame, CA, USA
Print_ISBN
0-7803-6678-6
Type
conf
DOI
10.1109/IITC.2001.930032
Filename
930032
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