• DocumentCode
    3193741
  • Title

    A model for interlevel coupling noise in multilevel interconnect structures

  • Author

    Saint-Laurent, Martin ; Ajmal, Zakaria ; Swaminathan, Madhavan ; Meindl, James D.

  • Author_Institution
    Intel Corp., Austin, TX, USA
  • fYear
    2001
  • fDate
    6-6 June 2001
  • Firstpage
    110
  • Lastpage
    112
  • Abstract
    In multilevel interconnect structures, the interconnect layers are practically always perpendicular to each other. Because of the capacitive coupling between adjacent layers, the switching activity in one layer produces noise in the other. This paper analyses the interlevel coupling noise present at the far end of a victim line when a large number of perpendicular attackers are randomly switching. Each attacker is modeled as a Markov chain and the victim is modeled as an RLC transmission line. The result is a novel closed-form expression for the power spectral density of the interlevel coupling noise.
  • Keywords
    Markov processes; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; Markov chain; RLC transmission line; adjacent layers; capacitive coupling; closed-form expression; interlevel coupling noise; multilevel interconnect structures; perpendicular attackers; power spectral density; randomly switching attackers; switching activity; Capacitance; Clocks; Closed-form solution; Conductors; Couplings; Crosstalk; Inductance; Integrated circuit interconnections; Power transmission lines; Transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
  • Conference_Location
    Burlingame, CA, USA
  • Print_ISBN
    0-7803-6678-6
  • Type

    conf

  • DOI
    10.1109/IITC.2001.930032
  • Filename
    930032