DocumentCode :
3193754
Title :
Operational characteristics of a 200°C LC parallel resonant circuit
Author :
Baumann, Eric D. ; Hammoud, Ahmad N.
Author_Institution :
NASA Lewis Res. Center, Cleveland, OH, USA
fYear :
1995
fDate :
22-25 Oct 1995
Firstpage :
270
Lastpage :
273
Abstract :
Research efforts are currently underway at the NASA Lewis Research Center to design and demonstrate an inverter capable of operating with a baseplate temperature of 200°C. In support of this project, various electrical components including capacitors, inductors, transformers, cables, and semiconductor switches are being developed or evaluated for integration into the inverter. In this work, a parallel LC resonant circuit was constructed and evaluated under simultaneous electrical and thermal stressing. The tests were performed in the temperature range of 25°C to 200°C with an applied voltage of up to 90 V, 20 kHz. The individual components were comprised of high temperature film capacitors and powder core inductors developed in-house. The circuit was characterized in terms of the component currents and case temperatures as well as frequency of resonance as a function of applied bias and temperature. The results obtained, which have indicated good functional stability up to 200°C, are presented and discussed
Keywords :
capacitors; circuit resonance; circuit stability; circuit testing; inductors; lumped parameter networks; passive networks; thermal stresses; 20 kHz; 25 to 200 C; 90 V; LC parallel resonant circuit; case temperatures; component currents; electrical stressing; functional stability; high temperature film capacitors; operational characteristics; powder core inductors; resonance frequency; thermal stressing; Cables; Capacitors; Inductors; Inverters; NASA; RLC circuits; Resonance; Switches; Temperature; Transformers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1995. Annual Report., Conference on
Conference_Location :
Virginia Beach, VA
Print_ISBN :
0-7803-2931-7
Type :
conf
DOI :
10.1109/CEIDP.1995.483715
Filename :
483715
Link To Document :
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