Title :
Modelling of the flow rate dependent partial thermal resistance of integrated microscale cooling structures
Author :
Takacs, G. ; Szabo, P.G. ; Bognar, Gy
Author_Institution :
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
As microscale cooling structures are integral parts of modern chip level cooling concepts, the understanding of the behavior of different assemblies is desirable to create a novel co-design concepts where the thermal design is embedded into the conventional IC design flow. The first step of understanding is to create a general formula which describes the heat transfer mechanism and can be implemented in IC CAD environments. This paper presents an analytical study of this mechanism in microscale channel based cooling structures. A closed analytical formula is also given to calculate the partial thermal resistance. Numerical analyses are also conducted and the results are compared against the analytical ones.
Keywords :
cooling; integrated circuit design; integrated circuit modelling; microchannel flow; thermal resistance; IC CAD environments; IC design flow; co-design concepts; heat transfer mechanism; microscale cooling structures; modern chip level cooling concepts; partial thermal resistance; thermal design; Cooling; Electronic packaging thermal management; Fluids; Heat transfer; Heating; Thermal resistance; integrated cooler; microchannel heat sink; thermal transient testing;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
DOI :
10.1109/DTIP.2015.7161012
