Three dimensional circuit oriented electromagnetic modeling for VLSI packaging

Summary form only given. Circuit-oriented approaches for the solution of interconnect problems were considered. Issues for partial element equivalent circuit modeling, such as retardation and dielectrics, were examined. This corresponds to a full wave electromagnetic solution of the problem. A further issue discussed was potential circuit solver methods for the solution of these problems. The solution of these problems is very time consuming due to the couplings, and exact as well as approximate solution techniques may be appropriate in some cases.<>