DocumentCode :
3194341
Title :
Wafer level packaging for hermetical encapsulation of MEMS resonators
Author :
Manier, Charles-Alix ; Zoschke, Kai ; Oppermann, Hermann ; Ruffieux, David ; Dalla Piazza, Silvio ; Suni, Tommi ; Dekker, James ; Allegato, Giorgio
Author_Institution :
Fraunhofer IZM, Berlin, Germany
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
6
Abstract :
This paper will present wafer level packaging approaches and results for MEMS encapsulation and integration applied to resonators. The core technologies involve interposer fabrication with Through-Silicon Vias (TSV), temporary wafer bonding for thin wafer handling and wafer bonding for metallic sealing under vacuum and for formation of electrical interconnects. Seal rings based on AuSn metallurgy have been considered for process compatibility with MEMS and provide the hermetical sealing of the components after vacuum encapsulation. Different packaging processes were tested and are here succinctly presented for established quartz crystals as well as for emerging Silicon Resonators (SiRes). First investigations on if, and possibly how, wafer dicing affects the packaged components were performed. A yield of 80% could be achieved in wafer level packaging of quartz crystal resonators at 8´´ wafer scale first step towards an ongoing 3D integration with CMOS.
Keywords :
crystal resonators; encapsulation; gold alloys; hermetic seals; microcavities; microfabrication; micromechanical resonators; silicon; three-dimensional integrated circuits; wafer bonding; wafer level packaging; 3D integration; AuSn; CMOS; MEMS encapsulation; MEMS resonators; Si; electrical interconnects; hermetical encapsulation; hermetical sealing; interposer fabrication; metallic sealing; quartz crystal resonators; seal rings; silicon resonators; temporary wafer bonding; thin wafer handling; through-silicon vias; vacuum encapsulation; wafer dicing; wafer level packaging; Crystals; Gold; Micromechanical devices; Packaging; Seals; Silicon; Substrates; Au/Sn; MEMS resonator; TSV; WLP; interposer; sealing; vacuum;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7161027
Filename :
7161027
Link To Document :
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