DocumentCode
3194360
Title
Limitations to copper grain growth in narrow trenches
Author
Brongersma, S.H. ; Kerr, E. ; Vervoort, I. ; Maex, K.
Author_Institution
IMEC, Leuven, Belgium
fYear
2001
fDate
6-6 June 2001
Firstpage
230
Lastpage
232
Abstract
Even though large variations are seen in transformation times for Copper blanket layers when changing layer thickness or plating current, the activation energy for secondary grain growth is always ∼ 0.9 eV. The difference is attributed to variations in the number of ´nucleation sites´ for secondary grains. As the number of such sites is extremely low in trenches, transformation times are very high even at elevated temperatures.
Keywords
copper; electroplated coatings; grain growth; metallisation; nucleation; Cu; activation energy; copper blanket layer; damascene processing; electroplating; grain growth; nucleation site; transformation time; trench filling; Acceleration; Additives; Annealing; Conductivity; Copper; Filling; Grain boundaries; Grain size; Impurities; Plasma temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
Conference_Location
Burlingame, CA, USA
Print_ISBN
0-7803-6678-6
Type
conf
DOI
10.1109/IITC.2001.930069
Filename
930069
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