Title :
Pattern dependent modeling of electroplated copper profiles
Author :
Park, Tae H. ; Tugbawa, Tamba E. ; Boning, Duane S.
Author_Institution :
Microsystems Technol. Lab., MIT, Cambridge, MA, USA
Abstract :
Copper electroplated profiles exhibit pattern dependent topography. We propose a methodology for the characterization and modeling of feature scale copper step heights and the height of copper array regions, as a function of layout parameters. The resulting empirical models with parameters extracted from conventional and super fill plating processes capture several key trends important in electroplating, and are the first step toward an integrated chip-scale copper plating/CMP simulation capability.
Keywords :
chemical mechanical polishing; copper; electroplated coatings; electroplating; integrated circuit metallisation; semiconductor process modelling; surface topography; CMP; Cu; array regions height; chip-scale copper plating; deposition model; electroplated copper profiles; feature scale step heights; integrated simulation capability; layout parameters; parameter extraction; pattern dependent modeling; pattern dependent topography; polynomial model; super fill plating; Area measurement; Chemicals; Copper; Data mining; Extraterrestrial measurements; Laboratories; Predictive models; Semiconductor device modeling; Surface topography; Testing;
Conference_Titel :
Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-6678-6
DOI :
10.1109/IITC.2001.930082
