• DocumentCode
    3194988
  • Title

    A new architecture for neural signal amplification in implantable brain machine interfaces

  • Author

    Rehman, Saif Ur ; Kamboh, Awais Mehmood

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci, Nat. Univ. of Sci. & Technol., Islamabad, Pakistan
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    2744
  • Lastpage
    2747
  • Abstract
    This paper reports a new architecture for variable gain-bandwidth amplification of neural signals to be used in implantable multi-channel recording systems. The two most critical requirements in such a front-end circuit are low power consumption and chip area, especially as number of channels increases. The presented architecture employs a single super-performing amplifier, with tunable gain and bandwidth, combined with several low-key preamplifiers and multiplexors for multi-channel recordings. This is in contrast to using copies of high performing amplifier for each channel as is typically reported in earlier literature. The resulting circuits consume lower power and require smaller area as compared to existing designs. Designed in 0.5μmCMOS, the 8-channel prototype can simultaneously record Local Field Potentials and neural spikes, with an effective power consumption of 3.5 μW per channel and net core area of 0.407mm2.
  • Keywords
    CMOS integrated circuits; biomedical electronics; brain-computer interfaces; digital signal processing chips; medical signal processing; multiplexing equipment; neurophysiology; power consumption; preamplifiers; CMOS; chip area; circuits; front-end circuit; high-performing amplifier; implantable brain machine interfaces; implantable multichannel recording systems; local field potentials; low-key preamplifiers; multiplexors; neural signal amplification; neural spikes; power 3.5 muW; power consumption; single superperforming amplifier; size 0.5 mum; variable gain-bandwidth amplification; 1f noise; Bandwidth; Electrodes; Power demand; Preamplifiers; Prototypes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6610108
  • Filename
    6610108