Abstract :
The following topics are dealt with: substrate interconnection technology; manufacturing technology; microstructure reliability testing; nanotechnology; MEMS packaging; photovoltaic packaging; LED packaging; bonding technology; energy technology; and embedded packaging technology.
Keywords :
integrated circuit bonding; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; light emitting diodes; micromechanical devices; LED packaging; MEMS packaging; bonding technology; embedded packaging technology; energy technology; manufacturing technology; microstructure reliability testing; nanotechnology; photovoltaic packaging; substrate interconnection technology;
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
