• DocumentCode
    3196091
  • Title

    Improve storage IO performance by using 85Ohm package and motherboard routing

  • Author

    Ye, Chunfei ; Ye, Xiaoning ; Do-Nguyen, Thanh

  • Author_Institution
    Data Center Group, Intel Corp., DuPont, WA, USA
  • fYear
    2010
  • fDate
    25-27 Oct. 2010
  • Firstpage
    281
  • Lastpage
    284
  • Abstract
    For high speed signaling, 100Ohm differential impedance has been commonly used for decades. In recent years, 85Ohm differential impedance has been adopted for PCIE Gen2 and Gen3 for better signal integrity performance and routing consideration. However, for storage IOs such as SATA and SAS, buffer, cable, and connector, etc, are 100Ohm design. It is not clear whether we still have better signal integrity performance using 85 ohm package and motherboard routing. In this paper, we will report simulation and measurement results for 3Gbps and 6Gbps SATA and SAS links, by comparing 85Ohm package and mother routing with 100Ohm routing. Results show that 85Ohm package and motherboard routing have better signal integrity performance than 100Ohm even if cable, connector, hard disk driver and buffer, etc, are all designed at 100Ohm. Our conclusion is very meaningful in defining interconnect impedance for new generation of storage IO specification such as SAS 12Gbps.
  • Keywords
    buffer storage; cables (electric); disc drives; hard discs; system buses; PCIE Gen2; PCIE Gen3; SAS; SATA; bit rate 12 Gbit/s; bit rate 3 Gbit/s; bit rate 6 Gbit/s; buffer; cable; connector; hard disk driver; interconnect impedance; motherboard routing; resistance 85 ohm; signal integrity performance; storage IO performance; storage IO specification; Connectors; Impedance; Jitter; Routing; Signal analysis; Silicon; Synthetic aperture sonar; 85Ohm; SAS; SATA; electrical packaging; high speed signalling; interconnects; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-6865-2
  • Electronic_ISBN
    978-1-4244-6866-9
  • Type

    conf

  • DOI
    10.1109/EPEPS.2010.5642794
  • Filename
    5642794