DocumentCode :
3196091
Title :
Improve storage IO performance by using 85Ohm package and motherboard routing
Author :
Ye, Chunfei ; Ye, Xiaoning ; Do-Nguyen, Thanh
Author_Institution :
Data Center Group, Intel Corp., DuPont, WA, USA
fYear :
2010
fDate :
25-27 Oct. 2010
Firstpage :
281
Lastpage :
284
Abstract :
For high speed signaling, 100Ohm differential impedance has been commonly used for decades. In recent years, 85Ohm differential impedance has been adopted for PCIE Gen2 and Gen3 for better signal integrity performance and routing consideration. However, for storage IOs such as SATA and SAS, buffer, cable, and connector, etc, are 100Ohm design. It is not clear whether we still have better signal integrity performance using 85 ohm package and motherboard routing. In this paper, we will report simulation and measurement results for 3Gbps and 6Gbps SATA and SAS links, by comparing 85Ohm package and mother routing with 100Ohm routing. Results show that 85Ohm package and motherboard routing have better signal integrity performance than 100Ohm even if cable, connector, hard disk driver and buffer, etc, are all designed at 100Ohm. Our conclusion is very meaningful in defining interconnect impedance for new generation of storage IO specification such as SAS 12Gbps.
Keywords :
buffer storage; cables (electric); disc drives; hard discs; system buses; PCIE Gen2; PCIE Gen3; SAS; SATA; bit rate 12 Gbit/s; bit rate 3 Gbit/s; bit rate 6 Gbit/s; buffer; cable; connector; hard disk driver; interconnect impedance; motherboard routing; resistance 85 ohm; signal integrity performance; storage IO performance; storage IO specification; Connectors; Impedance; Jitter; Routing; Signal analysis; Silicon; Synthetic aperture sonar; 85Ohm; SAS; SATA; electrical packaging; high speed signalling; interconnects; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
Type :
conf
DOI :
10.1109/EPEPS.2010.5642794
Filename :
5642794
Link To Document :
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