• DocumentCode
    3196127
  • Title

    Electromagnetics analysis codes

  • Author

    Elking, D.M. ; Alspach, S.D. ; Car, D.D. ; Castle, K.E. ; Karty, J.L. ; Knehans, J.H. ; Pearlman, R.A. ; Roedder, J.M.

  • Author_Institution
    McDonnell Douglas Corp., St. Louis, MO, USA
  • fYear
    1992
  • fDate
    18-25 June 1992
  • Firstpage
    1306
  • Abstract
    It has become necessary in the aerospace industry to analyze and design air vehicles with significant emphasis on reducing radar cross section (RCS). Highly complex air vehicle geometries ranging from a few wavelengths in size to a few thousand wavelengths are described using computer-aided design and drafting (CADD) systems. Computational electromagnetic analyses of these geometries severely stress the capability of CRAY supercomputers and are only beginning to be addressed by massively parallel supercomputers such as the Intel i/PSC860. The relative computational requirements of the Triangular Surface Patch (TSP) code which uses method of moments techniques and the CADDSCAT code which uses the physical theory of diffraction are examined. Typically, both types of low- and high-frequency codes are required to cover the design space.<>
  • Keywords
    CAD; aerospace computing; aircraft; electromagnetic fields; radar cross-sections; CADD; CADDSCAT code; Intel i/PSC860; Triangular Surface Patch; aerospace industry; air vehicles; computer-aided design and drafting; electromagnetic analysis codes; high-frequency; low-frequency; parallel supercomputers; physical theory of diffraction; radar cross section reduction; Aerospace industry; Computational electromagnetics; Computational geometry; Design automation; Electromagnetic analysis; Radar cross section; Stress; Supercomputers; Technical drawing; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE
  • Conference_Location
    Chicago, IL, USA
  • Print_ISBN
    0-7803-0730-5
  • Type

    conf

  • DOI
    10.1109/APS.1992.221759
  • Filename
    221759