• DocumentCode
    3196242
  • Title

    Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomography

  • Author

    Roth, Holger ; He, Zhenhui ; Mayer, Thomas

  • Author_Institution
    Gen. Electr. Sensing & Inspection Technol. GmbH, Stuttgart, Germany
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Through silicon vias (TSV) as used in 3D integrated electronic packages were inspected non-destructively by highly resolving nanofocus computed tomography (nanoCT). In particular, in the TSVs plating voids were visualised and quantitatively evaluated by numerical processing of the resulting volumetric data. The nanoCT technology is outlined and further applications such as interposers etc. are considered.
  • Keywords
    computerised tomography; elemental semiconductors; integrated circuit interconnections; integrated circuit packaging; nondestructive testing; numerical analysis; silicon; 3D integrated electronic packages; IC packages; high resolution nanofocus computed tomography; interconnections; nondestructive inspection; numerical processing; through silicon vias; Computed tomography; Detectors; Electron tubes; Inspection; Three dimensional displays; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642807
  • Filename
    5642807
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3196242