Title :
Inspection of through silicon vias (TSV) and other interconnections in IC packages by computed tomography
Author :
Roth, Holger ; He, Zhenhui ; Mayer, Thomas
Author_Institution :
Gen. Electr. Sensing & Inspection Technol. GmbH, Stuttgart, Germany
Abstract :
Through silicon vias (TSV) as used in 3D integrated electronic packages were inspected non-destructively by highly resolving nanofocus computed tomography (nanoCT). In particular, in the TSVs plating voids were visualised and quantitatively evaluated by numerical processing of the resulting volumetric data. The nanoCT technology is outlined and further applications such as interposers etc. are considered.
Keywords :
computerised tomography; elemental semiconductors; integrated circuit interconnections; integrated circuit packaging; nondestructive testing; numerical analysis; silicon; 3D integrated electronic packages; IC packages; high resolution nanofocus computed tomography; interconnections; nondestructive inspection; numerical processing; through silicon vias; Computed tomography; Detectors; Electron tubes; Inspection; Three dimensional displays; X-ray imaging;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642807
