DocumentCode
3196324
Title
Simulation of improved 3D tri-gate 4H-SiC MESFETs with recessed drift region
Author
Zhang, Jinping ; Zhang, Bo ; Li, Zhaoji
Author_Institution
State key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2008
fDate
25-27 May 2008
Firstpage
1291
Lastpage
1294
Abstract
An improved 3D tri-gate 4H-SiC MESFETs structure with recessed drift region was proposed and its DC and RF electrical performances were studied by numerical simulation. The recessed source/drain drift region of the proposed structure is to eliminate gate depletion layer extension to source/drain to decrease gate-source capacitance as well as to reduce the channel thickness between gate and drain to increase breakdown voltage. The simulated results showed that the maximum theoretical output power density, the cut-off frequency (fT) and the maximum oscillation frequency (fmax) of the proposed structure are 18.5 W/mm, 19.3 GHz and 74.1 GHz compared to 15.5 W/mm, 16.1 GHz and 55.9 GHz of that of the published 3D tri-gate structure, respectively.
Keywords
MESFET integrated circuits; 3D tri-gate 4H-SiC MESFETs; SiC; cut-off frequency; frequency 16.1 GHz; frequency 19.3 GHz; frequency 55.9 GHz; frequency 74.1 GHz; gate-source capacitance; maximum oscillation frequency; recessed drift region; recessed source/drain drift region; Capacitance; Cutoff frequency; Doping; Laboratories; MESFETs; Radio frequency; Silicon carbide; Strips; Thermal conductivity; Thin film devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, Circuits and Systems, 2008. ICCCAS 2008. International Conference on
Conference_Location
Fujian
Print_ISBN
978-1-4244-2063-6
Electronic_ISBN
978-1-4244-2064-3
Type
conf
DOI
10.1109/ICCCAS.2008.4658003
Filename
4658003
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