Title :
High yield thermode bond process under activated atmosphere and inline thermal interface measurement for high power optoelectronic devices
Author :
Elger, Gordon ; Lauterbach, Reinhard ; Feder, Reiner ; Dankwart, Kurt ; Zilkens, Christopher
Author_Institution :
Global Technol. Dev. Mechanization, Philips Technol. GmbH, Aachen, Germany
Abstract :
The paper reports two equipment development projects in the field of die bonding and die bond testing. Part one deals with the a new confinement system for flux free die bond processes under formic acid enriched process gas on thermode bonders. Part two describes a new inline test equipment for controlling the solder joints by applying the transient temperature test method under inline condition.
Keywords :
microassembling; optoelectronic devices; solders; temperature measurement; activated atmosphere; confinement system; die bond testing; equipment development project; flux free die bond process; formic acid enriched process gas; high yield thermode bond process; inline test equipment; inline thermal interface measurement; optoelectronic devices; solder joint control; thermode bonder; transient temperature test method; Resistance heating; Switches;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642812
