High performance controlled impedance interconnection system

The limitation of future system performance of very high-speed, massively parallel computers and signal processors lies in the arena of electronic interconnections and packaging. Unless good solutions are found, systems will not be able to capitalize on the intrinsic capabilities of the latest active devices, which are capable of switching in the picosecond and even femtosecond domain. An interconnection system has been developed which permits the mating of 900 contacts per daughterboard to a motherboard. The unit is modular, so that a larger number (i.e. in excess of 20) daughterboards could be mated to a motherboard. Although the present design incorporates 900 contacts per daughterboard, this could be increased to 2000 contacts. All of the contacts have been designed with controlled impedance to 50 Ω. Units have been built, tested, and delivered to customers for their evaluation