Title :
HT/sub c/ superconductive interconnections for ultra fast logic circuits
Author :
Cabon, B. ; Vu Dinh, T. ; Chilo, J.
Author_Institution :
LEMO-ENSERG, Grenoble, France
Abstract :
Summary form only given. The authors present modeling results in frequency domain and experimental validation of superconductive transmission lines. SPICE simulations have demonstrated the advantages of using the high T/sub c/ superconductive interconnections for applications to fast logic circuits and their integration in multichip modules. Low losses of these materials allow novel devices to be studied (delay lines, devices with controlled dispersion, etc.).<>
Keywords :
SPICE; circuit analysis computing; frequency-domain analysis; high-temperature superconductors; logic circuits; multichip modules; packaging; strip lines; superconducting devices; SPICE simulations; controlled dispersion; delay lines; experimental validation; frequency domain; high T/sub c/ superconductive interconnections; multichip modules; superconductive transmission lines; ultra fast logic circuits; Circuit simulation; Distributed parameter circuits; Frequency domain analysis; Integrated circuit interconnections; Logic circuits; Multichip modules; SPICE; Superconducting materials; Superconducting transmission lines; Superconductivity;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-0730-5
DOI :
10.1109/APS.1992.221782
