Title :
The packaging technologies for photovoltaic modules - technological challenges and mechanical integrity
Author :
Wiese, Steffen ; Kraemer, Frank ; Betzl, Norbert ; Wald, Dietmar
Author_Institution :
Lab. for Microintegration & Reliability, Saarland Univ., Saarbrucken, Germany
Abstract :
The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to significant mechanical problems, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection technologies are needed to release mechanical stresses during the assembly process.
Keywords :
assembling; packaging; solar cells; assembly process; interconnection wires; mechanical integrity; mechanical problem; mechanical stress; packaging technology; photovoltaic modules; solar cells; Aluminum; Glass; Plastics; Silver;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642824