DocumentCode
3196607
Title
The packaging technologies for photovoltaic modules - technological challenges and mechanical integrity
Author
Wiese, Steffen ; Kraemer, Frank ; Betzl, Norbert ; Wald, Dietmar
Author_Institution
Lab. for Microintegration & Reliability, Saarland Univ., Saarbrucken, Germany
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
6
Abstract
The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to significant mechanical problems, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection technologies are needed to release mechanical stresses during the assembly process.
Keywords
assembling; packaging; solar cells; assembly process; interconnection wires; mechanical integrity; mechanical problem; mechanical stress; packaging technology; photovoltaic modules; solar cells; Aluminum; Glass; Plastics; Silver;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642824
Filename
5642824
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