Title :
HT/sub c/ superconductive interconnections SPICE modeling for microwave applications
Author :
Vu Dinh, T. ; Cabon, B. ; Chilo, J.
Author_Institution :
LEMO-ENSERG, Grenoble, France
Abstract :
Summary form only give. An original modeling concept describing superconducting material through an equivalent circuit is proposed. It allows superconducting interconnections to be analyzed using any electrical nodal simulator (SPICE, for example). A typical superconducting microstrip line has been analyzed. The variations of the attenuation constant at 77 K versus frequency calculated by the proposed equivalent circuit method and by the PEM method of H.Y.-Lee et al. (see IEEE Trans. on Micro. Theory and Tech. vol.37, no.12, p.1904, 1989) are shown. A good agreement between these two results is observed.<>
Keywords :
SPICE; circuit analysis computing; equivalent circuits; high-temperature superconductors; microstrip lines; packaging; superconducting microwave devices; PEM method; SPICE modeling; attenuation constant; electrical nodal simulator; equivalent circuit; frequency; high T/sub c/ superconductive interconnections; microwave applications; superconducting material; superconducting microstrip line; Circuit simulation; Conductors; Current density; Equivalent circuits; Integrated circuit interconnections; SPICE; Superconducting materials; Superconducting microwave devices; Superconductivity; Voltage;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-0730-5
DOI :
10.1109/APS.1992.221784
