Integrated LED modules

An experimental and modeling study was done on the system architecture of integrated LED modules. Goal was to realize minimal footprint modules with optimized LED-to-package ratio and integrated driver aiming at maximal étendue and maximal lumens/area light output. This while staying within the boundary conditions of thermal load on the LEDs, driver ASIC and package and assembly materials. A number of multi-LED multi-color intelligent modules were designed, modeled, realized and evaluated. Lateral and vertical configurations of LEDs and ASIC in a leadless package were realized based on industrially known assembly technologies and using available LEDs and a dedicated ASIC chip. Concurrent design of module and receiving printed board was used to obtain the best thermal solution.