Title :
High T/sub c/ superconducting device development at Du Pont
Author :
Zhi-Yuan Shen ; Wilker, C. ; Pang, P.S.W. ; Laubacher, D.B. ; Holstein, W.L. ; Face, D.W. ; Kountz, D.J. ; Matthews, A.L. ; Meriwether, J.M. ; Carter, C.F.
Abstract :
A summary of the high T/sub c/ superconducting (HTS) device development program at Du Pont over the past two years is presented. A number of HTS devices have been designed, fabricated and tested, such as a 5-GHz microstrip line resonator; 3-pole, 5-pole, and 7-pole microstrip line bandpass filters; an 11 ns coplanar delay line; a 0.5-4.5 GHz 7-section Chebyshev microstrip line power splitter/combiner; a 5.55 GHz HTS-sapphire resonator with extremely high Q value; and a III-V semiconductor-HTS hybrid amplifier and oscillator. The thin film HTS materials used for fabricating these devices were: YBaCuO
Keywords :
band-pass filters; delay lines; high-temperature superconductors; microstrip components; microwave amplifiers; microwave filters; microwave integrated circuits; microwave oscillators; passive filters; resonators; solid-state microwave devices; superconducting microwave devices; 0.5 to 4.5 GHz; 11 ns; 3-pole filter; 5 GHz; 5-pole filter; 5.55 GHz; 7-pole filter; Chebyshev microstrip line power splitter/combiner; Du Pont; HTS devices; HTS-sapphire resonator; III-V semiconductor; Q value; SHF; TlBaCaCuO; TlPbSrCaCuO; UHF; YBaCuO; amplifier; coplanar delay line; design; high T/sub c/ superconducting devices; high power handling; microstrip line bandpass filters; microstrip line resonator; oscillator; testing; thin film HTS materials; very low surface resistance; Band pass filters; Delay lines; High temperature superconductors; III-V semiconductor materials; Microstrip filters; Microstrip resonators; Semiconductor device testing; Superconducting devices; Superconducting filters; Surface resistance;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-0730-5
DOI :
10.1109/APS.1992.221789
