• DocumentCode
    3196830
  • Title

    Skew incidence on a thick metal-dielectric join

  • Author

    Ozdemir, T. ; Volakis, J.L.

  • Author_Institution
    Dept. of Electr. Eng., & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1992
  • fDate
    18-25 June 1992
  • Firstpage
    949
  • Abstract
    A skew incidence solution is presented for the diffraction by a metal-dielectric junction. Some practical applications of this result relate to a characterization of surface propagation across the seashore and the scattering by airframe discontinuities including those found in conformal arrays. The two-dimensional version of this problem has been treated previously for E and H polarization, and it is shown that the new skew incidence solution reduces to these special cases when beta = pi /2. The generalized scattering matrix formulation and the Weiner-Hopf technique are used to solve the integral equations arising after enforcing field continuity across the dielectric interfaces and the condition that the tangential electric fields vanish on the metallic surfaces.<>
  • Keywords
    S-matrix theory; dielectric materials; electromagnetic wave diffraction; electromagnetic wave scattering; metals; EM wave scattering; Weiner-Hopf technique; airframe discontinuities; conformal arrays; dielectric interfaces; diffraction; field continuity; generalized scattering matrix; integral equations; metallic surfaces; seashore; skew incidence solution; surface propagation; tangential electric fields; thick metal-dielectric join; Application software; Computer science; Dielectrics; Diffraction; Equations; Polarization; Scattering; Slabs; Surface treatment; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE
  • Conference_Location
    Chicago, IL, USA
  • Print_ISBN
    0-7803-0730-5
  • Type

    conf

  • DOI
    10.1109/APS.1992.221794
  • Filename
    221794