Title :
Epoxy resin curing process evaluation based on signal frequency analysis from interdigital structure sensor
Author :
Blecha, Tomas ; Pihera, Josef
Author_Institution :
Dept. of Technol. & Meas., Univ. of West Bohemia in Pilsen, Pilsen, Czech Republic
Abstract :
The epoxy resin curing is a chemical process that consists of several important steps within its curing time. These steps could be identified as gelation point, curing, vitrification and final solid state of the resin. These points of curing process are identifiable by standard electrical measurement methods but the use of unique test equipment is necessary. Therefore, new possibilities of detection these important points of curing process are to be searched. All information about epoxy resin curing have to be known for correct technology process control. Based on that, it is necessary to analyze the curing process and to find its important curing points. During epoxy resin curing process some electrical parameters are changing. And here comes this new method into account. If a suitable sensor is placed in the epoxy resin during curing process then the above mentioned important points of curing process could be monitored and identified based on frequency analysis of signals from this sensors. The electrode structure sensor was used for measuring of signals and their changes during the epoxy resin curing process. This article deals with the evaluation process based on the spectral analysis of signals obtained from electrode structure sensor.
Keywords :
curing; electric sensing devices; electric variables measurement; resins; spectral analysis; test equipment; chemical process; electrode structure sensor; epoxy resin curing process evaluation; gelation point; interdigital structure sensor; signal frequency analysis; spectral analysis; standard electrical measurement methods; technology process control; test equipment; vitrification; Curing; Impedance; Substrates; Temperature measurement; Temperature sensors; Vitrification;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642838