• DocumentCode
    3196875
  • Title

    Nanostructured CuO Films on Copper: Fabrication and Application as a Cathode in Dye-Sensitized TiO2 Solar Cells

  • Author

    Liu, Qiudi ; Anandan, S. ; Yang, S.H. ; Ge, W.K.

  • Author_Institution
    Dept. of Phys. & Astron., Toledo Univ., OH
  • Volume
    1
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    229
  • Lastpage
    232
  • Abstract
    Nanostructured CuO films are grown on copper substrates by a wet chemical method in a water bath. It has been successfully used as a cathode for dye-sensitized TiO2 nanoparticle solar cells. The effects of reaction temperature, time, and pH on the film properties and solar energy conversion have been investigated. Under favorable conditions, we obtain a short circuit current density of Jsc=0.83 mA/cm2, an open circuit voltage of Voc=0.59 mV, a fill factor of FF=0.25, and a power conversion efficiency of etae=0.82%(with white light illumination: 15 mW/cm2). The nanostructured CuO films appear to be a promising hole-transport media in dye-sensitized solar cells for the photocurrent generation
  • Keywords
    cathodes; copper compounds; current density; dyes; hole mobility; nanostructured materials; nanotechnology; pH; photoconductivity; semiconductor growth; semiconductor thin films; solar cells; titanium compounds; Cu; CuO; TiO2; cathode; copper substrates; dye-sensitized nanoparticle solar cells; film properties; hole-transport media; nanostructured film fabrication; open circuit voltage; p-type semiconductor; pH; photocurrent generation; power conversion efficiency; reaction temperature; short circuit current density; solar energy conversion; water bath; wet chemical method; Cathodes; Chemicals; Copper; Fabrication; Photovoltaic cells; Short circuit currents; Solar energy; Substrates; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279431
  • Filename
    4059604