DocumentCode :
3196921
Title :
An artificial arm/hand system with a haptic sensory function using electric stimulation of peripheral sensory nerve fibers
Author :
Mabuchi, K.
Author_Institution :
Dept. of Inf. Phys. & Comput., Univ. of Tokyo, Tokyo, Japan
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
3130
Lastpage :
3133
Abstract :
We are currently developing an artificial arm/hand system which is capable of sensing stimuli and then transferring these stimuli to users as somatic sensations. Presently, we are evoking the virtual somatic sensations by electrically stimulating a sensory nerve fiber which innervates a single mechanoreceptor unit at the target area; this is done using a tungsten microelectrode that was percutaneously inserted into the use´s peripheral nerve (a microstimulation method). The artificial arm/hand system is composed of a robot hand equipped with a pressure sensor system on its fingers. The sensor system detects mechanical stimuli, which are transferred to the user by means of the microstimulation method so that the user experiences the stimuli as the corresponding somatic sensations. In trials, the system worked satisfactorily and there was a good correlation between the pressure applied to the pressure sensors on the robot fingers and the subjective intensities of the evoked pressure sensations.
Keywords :
artificial limbs; bioelectric phenomena; biomedical electrodes; haptic interfaces; mechanoception; medical robotics; microelectrodes; neurophysiology; pressure sensors; artificial arm/hand system; electric stimulation; evoked pressure sensation; haptic sensory function; mechanical stimuli; microstimulation method; peripheral sensory nerve fiber; pressure sensor system; robot finger; robot hand; single mechanoreceptor unit; stimuli sensing; target area; tungsten microelectrode; virtual somatic sensation; Microelectrodes; Nerve fibers; Robot sensing systems; Thumb;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610204
Filename :
6610204
Link To Document :
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