DocumentCode :
3197046
Title :
Head on pillow defects in BGAs solder joints
Author :
Arazna, Aneta ; Koziol, Grazyna ; Steplewski, Wojciech ; Lipiec, Krzysztof
fYear :
2010
fDate :
13-16 Sept. 2010
Firstpage :
1
Lastpage :
4
Abstract :
The growing use of lead-free soldering, ultra-fine pitch and area-array devices in electronics manufacturing create new type of defects, such as “head-on-pillow” (HoP). The head-on-pillow soldering defect occurs as a result of the incomplete merging of the BGA/CSP component sphere and the molten solder paste during reflow. This defect was observed during realization of our research, mainly in solder joints of BGA676 components. To prevent and reduce the head-on-pillow defects as well as understand and address this issue a series of experiments were done.
Keywords :
ball grid arrays; chip scale packaging; fine-pitch technology; reflow soldering; solders; BGA/CSP component sphere; BGA676 components; HoP; area-array devices; electronics manufacturing; head on pillow defects; head-on-pillow soldering defect; lead-free soldering; molten solder paste; reflow; solder joints; ultra-fine pitch; Copper; Indium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
Type :
conf
DOI :
10.1109/ESTC.2010.5642849
Filename :
5642849
Link To Document :
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