DocumentCode
3197199
Title
Adhesion of moulding compounds on various surfaces. A study on moisture influence and degradation after high temperature storage
Author
Pufall, R. ; Goroll, M. ; Bouazza, M. ; Wittler, O. ; Michel, B.
Author_Institution
Infineon Technol. AG, Neubiberg, Germany
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
3
Abstract
It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. During normal operation of electronic components, heat is generated locally (bond wire, or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or bond wires.
Keywords
adhesion; coating techniques; copper; metallisation; moulding; bond wires; chip coating; chip encapsulation; copper; electronic component; lead frames; metallisation; moisture influence; moulding compound adhesion; polyimide; Adhesives; Copper; Irrigation; Lead; Nickel; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642855
Filename
5642855
Link To Document