X-ray resistant packaging for X-ray line detectors

The challenges of electronics packaging and system integration require new non-destructive evaluation (NDE) techniques during production processes for fast and reliable detecting of small defects like shorts, missing parts or contacts and voids. X-ray techniques like radiography, limited angle tomography and computed tomography are very important methods. Today the common detector principle for X-rays is the so called scintillation detector with a CCD camera behind. But more and more the industry needs fast, reliable and low-cost X-ray systems. That´s why direct converting line detectors are on the engineers focus to be used for “real-time” X-ray scanners. Our paper presents the development of a X-ray resistant detector´s module packaging.