Title :
Flip Chip bonding with Elasticity Bonding System and Non Conductive Film suitable for intermetallic compounds formation
Author :
Kojima, Ryoji ; Saito, Takayuki ; Matsumura, Takashi ; Koyama, Taichi ; Umetsu, Norio ; Furuta, Kazutaka ; Nishimura, Junichi ; Moriyama, Hironobu
Author_Institution :
Sony Chem. & Inf. Device Corp., Japan
Abstract :
Anisotropic Conductive Film (ACF) and Non Conductive Film (NCF) are widely used in LCD industry. And these thermosetting resin film have been studied to apply to flip chip bonding. However conventional NCF cured so fast when bonded at around 230 degree, which is liquidus of Pb free solder, the cured resin remained between IC bumps and substrate pads. We developed two types of NCF by adjusting curing temperature and melting viscosity, and confirmed that one is good for substrate with Ni-Au plated electrode and another one with flux function is good for substrate with Organic Solderability Preservative (OSP) treated Cu electrode. And we are developing "NCF on wafer" process. This can omit NCF laminating machine and laminating tact. We confirmed that dicing and alignment at flip chip bonding can be processed even with the filler contained translucent NCF when ring light wad employed.
Keywords :
alloys; bonding processes; flip-chip devices; resins; LCD industry; anisotropic conductive film; curing temperature; dicing; elasticity bonding system; flux function; intermetallic compound formation; melting viscosity; nonconductive film; organic solderability preservative; thermosetting resin film; Copper; Electrodes; Heating; Pins; Substrates; Wavelength measurement;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642868
