Title :
Nano materials for microelectronic packaging
Author :
Wong, C.P. ; Lin, W. ; Zhang, R.
Author_Institution :
Microsyst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper addresses the state-of-the-art nano science and technology regarding next generation high density microelectronics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal interface materials, nano alloys for low temperature surface mount assembly and molecular wires for electrical interconnects.
Keywords :
carbon nanotubes; integrated circuit interconnections; integrated circuit packaging; surface mount technology; carbon nanotubes; electrical interconnects; electrical-thermal interface materials; high density microelectronics packaging applications; low temperature surface mount assembly; molecular wires; nano alloys; nanomaterials; nanoscience; Carbon; Electron tubes; Integrated circuits; Presses; RNA; Tin;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642891
