DocumentCode :
3198004
Title :
Power cycling tests at high temperatures with IGBT power modules for hybrid electrical vehicle applications
Author :
Hensler, A. ; Lutz, J. ; Thoben, M. ; Zachariae, J.
Author_Institution :
Chemnitz Univ. of Technol., Chemnitz, Germany
fYear :
2010
fDate :
13-16 Sept. 2010
Firstpage :
1
Lastpage :
6
Abstract :
In this publication, test results of power cycling tests are presented with 600V IGBT power modules for hybrid electrical vehicle (HEV) applications at high junction temperatures. First, the power cycling capability of standard packaging technology in wide ΔTj range is investigated. Afterwards the reliability improvement of new packaging technologies is shown.
Keywords :
hybrid electric vehicles; insulated gate bipolar transistors; semiconductor device packaging; semiconductor device reliability; IGBT power modules; hybrid electrical vehicle applications; power cycling tests; standard packaging technology; voltage 600 V; Cooling; Insulated gate bipolar transistors; Junctions; Multichip modules; Reliability; Temperature measurement; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
Type :
conf
DOI :
10.1109/ESTC.2010.5642894
Filename :
5642894
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3198004
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