Title :
Modeling and analysis of coplanar bonding wires for high-speed applications
Author :
Tschoban, Christian ; Ndip, Ivan ; Schmidt, Stefan ; Guttowski, Stephan ; Schneider-Ramelow, Martin ; Lang, Klaus-Dieter ; Reichl, Herbert
Author_Institution :
IZM, Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
Abstract :
In this contribution, two-conductor and coplanar bond wire configurations are modeled, analyzed and compared. The impact of the pitch of the bond wires and the distance of separation between the signal wire and a nearby reference plane, on RF performance are quantified for GSM 900/1800, 2.4 GHz/5GHz WLAN and high-speed applications above 10 GHz. Considering a bond wire diameter of 50 μm, length of 1mm and pitch of 100 μm, it is found that almost 3 times more power is lost through the two-conductor model than coplanar configuration at 10 GHz. This makes the coplanar configuration more suited for high-speed applications.
Keywords :
cellular radio; conductors (electric); lead bonding; wireless LAN; GSM 900/1800; RF performance; WLAN; coplanar bond wire configuration; frequency 10 GHz; frequency 2.4 GHz; frequency 5 GHz; high-speed application; two-conductor configuration; Artificial neural networks; GSM; Integrated circuit modeling; Next generation networking; Radio frequency;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642896
