DocumentCode :
3198062
Title :
Multi-physics modelling for packaging of Liquid Crystal Displays in harsh environments
Author :
Bailey, Chris ; Hua Lu ; Chunyan Yin ; Yek Lee
Author_Institution :
Comput. Mech. & Reliability Group, Univ. Of Greenwich, London, UK
fYear :
2010
fDate :
13-16 Sept. 2010
Firstpage :
1
Lastpage :
6
Abstract :
Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effects on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display´s using an array of LEDs as the backlight.
Keywords :
LED displays; electronics packaging; liquid crystal displays; LED backlight; adaptive light control; harsh environment; integrated modelling; light emitting diode; liquid crystal display; multi-physics modelling; packaging; reliability; ruggedized electronic display; thermal management; thermal modelling; Green products; Light emitting diodes; Optical reflection; Substrates; Variable speed drives; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
Type :
conf
DOI :
10.1109/ESTC.2010.5642898
Filename :
5642898
Link To Document :
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