Characterization of a 90 degrees curved microstrip transmission line in the time-domain and frequency-domain with 3D-TLM-method and measurements

Author

Thomann, W. ; Isele, B. ; Russer, P.

Author_Institution

Lehrstuhl fuer Hochfrequenztech., Tech. Univ., Munchen, Germany

fYear

1992

fDate

18-25 June 1992

Firstpage

658

Abstract

A 90 degrees curved microstrip transmission line is characterized in the time domain and frequency domain with the transmission line matrix method in 3D space and with supporting measurements up to 40 GHz. Results of this structure realized on 10 mm alumina substrate are presented. The S-parameters as a function of frequency and the time-domain step response are discussed in detail. The microstrip line consists of a bend with short straight transmission lines on both sides of the bend. The structure is placed in a 90 degrees corner with two electric walls, which represent a housing. The other two sides and the top lid are far removed in order to avoid any additional disturbances of the fields. Measurements and simulation verify the operation at frequencies above 40 GHz.<>

Keywords

S-parameters; microstrip lines; step response; time-frequency analysis; transmission line theory; 0.01 to 40 GHz; 10 mm; 3D space; 90 degrees curved microstrip transmission line; Al/sub 2/O/sub 3/ substrate; EHF; HF; S-parameters; SHF; UHF; VHF; electric walls; frequency domain; step response; straight transmission lines; time domain; transmission line matrix method; Extraterrestrial measurements; Frequency domain analysis; Frequency measurement; Microstrip; Scattering parameters; Time domain analysis; Time measurement; Transmission line matrix methods; Transmission line measurements; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE

Conference_Location

Chicago, IL, USA

Print_ISBN

0-7803-0730-5

Type

conf

DOI

10.1109/APS.1992.221851

Filename

221851