A novel approach to embed off-chip RF passives in PCB based on thin film technology

Author

Wang, Liang ; Christiaens, Wim ; Brebels, Steven ; De Raedt, Walter ; Vanfleteren, Jan

Author_Institution

CMST, IMEC, Ghent, Belgium

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

4

Abstract

Embedding passive components (EPCs) is known as a promising technology to provide high electrical performance and to reduce fabrication cost. This paper describes a novel approach to embed off-chip RF passives based on thin film stack. Multilayer structures are built-up on temporary glass carrier substrates by repetitive application of spin-coated polyimide layers and sputtered metal layers. After processing and testing the structures can easily be released from the carrier and embedded inside PCB or FCB (flexible PCB).

Keywords

UHF filters; chromium alloys; copper alloys; flexible electronics; low-pass filters; metals; microwave filters; multilayers; nickel alloys; passive networks; polymers; printed circuits; sputtered coatings; thin film inductors; thin film resistors; titanium alloys; tungsten alloys; NiCr-Cu-TiW; SiO₂-Jk; embedded passive components; flexible PCB; multilayer structures; off-chip RF passives; spin-coated polyimide layers; sputtered metal layers; temporary glass carrier substrates; thin film stack; Inductors; Metals; Nonhomogeneous media; Polyimides; Radio frequency; Resistors; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642905

Filename

5642905