DocumentCode :
3198354
Title :
An advanced RF-CV method as a powerful characterization tool for the description of HC induced defect generation at microscopic level
Author :
Negre, L. ; Roy, D. ; Scheer, P. ; Gloria, D. ; Ghibaudo, G.
Author_Institution :
IMEP-LAHC, Grenoble, France
fYear :
2011
fDate :
16-20 Oct. 2011
Firstpage :
73
Lastpage :
76
Abstract :
A MOS Capacitance-Voltage method in Radio-Frequency domain is presented. Characterization at higher frequency is becoming essential especially for advanced technology nodes that are confronted with gate leakage. Contrary to all other present methods, a full exploitation of S-parameters is performed to get key information regarding defect localization. The technique allows for MOS parameter extraction of the intrinsic and extrinsic components which enhances the scope of the defect localization area. An application of this method is performed to physically analyse the impact of three different energetic hot carrier degradation modes and also point out the unique signature of each degradation mode.
Keywords :
MOSFET; S-parameters; hot carriers; radiofrequency measurement; HC induced defect generation; MOS capacitance-voltage method; MOS parameter extraction; S-parameter measurements; advanced RF-CV method; energetic hot carrier degradation modes; extrinsic components; intrinsic components; microscopic level; radiofrequency domain; Capacitance; Degradation; Logic gates; MOSFETs; Resistance; Scattering parameters; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4577-0113-9
Type :
conf
DOI :
10.1109/IIRW.2011.6142592
Filename :
6142592
Link To Document :
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