Title :
TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration
Author :
Druais, G. ; Ancey, P. ; Chapelon, L.L. ; Charbonnier, J. ; Cheramy, S. ; Dodo, Y. ; Farcy, A. ; Garnier, G. ; Guillou, Y. ; Henry, D. ; Leduc, P. ; Pruvost, J. ; Saugier, E. ; Sillon, N.
Author_Institution :
STMicroelectronics, Crolles, France
Abstract :
3D integration development has to be driven by industrial demand and applications. To get interested in those technological developments, industrials shall be convinced by benefits of Through Silicon Vias (TSV) integration versus traditional assembly approach. This will demonstrate that this approach is worth being more developed and implemented. In this study, we demonstrated that we are able to achieve similar performance for a given product using a standard wire bonding packaging and an integration with TSV. Both electrical measurements on test structures and characterization on product are compared.
Keywords :
electronic products; electronics packaging; lead bonding; 3D integration; electrical measurements; standard wire bonding packaging; test characterization; test structures; through silicon vias integration; traditional assembly approach; wireless industrial product; CMOS integrated circuits; CMOS technology; Copper; Industries; Micromechanical devices; Photonics; Through-silicon vias;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642920
