Title :
Considerations on the measurement of active differential devices using baluns
Author :
Issakov, Vadim ; Wojnowski, Maciej ; Thiede, Andreas ; Winkler, Volker ; Tiebout, Marc ; Simbürger, Werner
Author_Institution :
Dept. of High-Freq. Electron., Univ. of Paderborn, Paderborn, Germany
Abstract :
The characterization of active differential devices requires a four-port vector network analyzer. Thus, it is a common practice to attach balanced-unbalanced (balun) circuits to convert between single-ended and differential signals and perform the measurement using a lower cost two-port vector network analyzer (VNA) or a spectrum analyzer. However, removing the impact of baluns is a challenge. This paper presents an analytical analysis of the back-to-back interconnection of the baluns and considers the common de-embedding technique insertion loss. This technique is commonly applied for two-port measurements of differential devices to remove the impact of the baluns. The applicability and accuracy of this approach is discussed. The analytical results have been verified on a differential low-noise-amplifier (LNA) at 24 GHz realized in Infineon´s B7HF200 SiGe:C technology. It is measured directly using a four-port network analyzer and the results are compared with a measurement using baluns and a two-port network analyzer.
Keywords :
baluns; differential amplifiers; low noise amplifiers; microwave amplifiers; multiport networks; network analysers; spectral analysers; B7HF200 technology; SiGe:C; active differential devices; back-to-back interconnection; balanced-unbalanced circuits; baluns; differential Low-Noise-Amplifier; four-port network analyzer; frequency 24 GHz; insertion loss; lower cost two-port vector network analyzer; spectrum analyzer; Costs; Frequency; Impedance matching; Insertion loss; Integrated circuit interconnections; Loss measurement; Particle measurements; Performance evaluation; Scattering parameters; Spectral analysis;
Conference_Titel :
Microwaves, Communications, Antennas and Electronics Systems, 2009. COMCAS 2009. IEEE International Conference on
Conference_Location :
Tel Aviv
Print_ISBN :
978-1-4244-3985-0
DOI :
10.1109/COMCAS.2009.5385972