DocumentCode :
3198629
Title :
Joule heating temperature prediction for inductor
Author :
Siegert, Laurent ; Fiannaca, Guillaume ; Gautier, Gaël
Author_Institution :
ST Microelectron. Tours R&D, Tours, France
fYear :
2011
fDate :
16-20 Oct. 2011
Firstpage :
121
Lastpage :
124
Abstract :
The aim of this work is to define a joule heating prediction tool under DC stress for thick copper/Low-k inductors on glass substrate technology. The thermal resistance experimental results have been approximated by an empirical model and, combined with thermal coefficient of resistance formalism; allow us to define an analytical temperature joule heating formula. This analytical joule heating formula can be widely used to define the maximum operating conditions and able to be implemented in design rules manuals.
Keywords :
approximation theory; inductors; thermal resistance; DC stress; SiO2; analytical joule heating formula; copper-low-k inductors; glass substrate technology; inductor; joule heating prediction tool; joule heating temperature prediction; resistance formalism; temperature joule heating formula; thermal coefficient; thermal resistance; Copper; Electrical resistance measurement; Inductors; Surface resistance; Temperature measurement; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4577-0113-9
Type :
conf
DOI :
10.1109/IIRW.2011.6142605
Filename :
6142605
Link To Document :
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