Title :
Designing and manufacturing a compact kW-dissipation power supply using a new copper on ceramic interconnect technology
Author :
Balents, Leon ; Morrison, Jim ; Skoczylas, Dan ; King, Ray
Author_Institution :
Varity Zecal, Churchville, NY, USA
Abstract :
A plated copper on ceramic interconnect technology named Z-Strate TM is being applied to high-power structures like compact power supplies with dissipation in the kW range. Improvements in size, thermal management, manufacturability and cost are being achieved. Methods used, results achieved and techniques for exploiting Z-Strate´s unique features are presented
Keywords :
AC-DC power convertors; ceramics; copper; integrated circuit interconnections; power integrated circuits; power supplies to apparatus; rectifying circuits; Z-StrateTM; compact power supplies; copper-on-ceramic interconnect technology; cost; design; kW range power dissipation; manufacturability; manufacture; size; thermal management; Ceramics; Conducting materials; Copper; Dielectric materials; Integrated circuit interconnections; Manufacturing; Power supplies; Resistors; Resists; Thick films;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-4340-9
DOI :
10.1109/APEC.1998.647732
