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Summary form only given. Chip microscale liquid-cooling reduces thermal resistance and improves datacenter efficiency with higher coolant temperatures. This eliminates the need for chillers and allows the thermal energy reuse in cold climates. We demonstrated a 60°C hot water cooled supercomputers with twofold lower energy cost and a fivefold lower carbon footprint. Energy re-use for desalination and adsorption cooling allows close to full use of datacenter heat in all climates. Higher output temperatures for these applications require embedded hotspot adapted cooling. Interlayer cooled 3D chip stacks allow large efficiency gains due to shorter average communication distances.