Title :
Tradeoff and Sensitivity Analysis of a Hybrid Model for Ranking Commercial Off-the-Shelf Products
Author :
Ibrahim, Hamdy ; Far, Behrouz H. ; Eberlein, Armin
Author_Institution :
Univ. of Calgary, Calgary, AB
Abstract :
Despite its popularity, The COTS-based development still faces some challenges, in particular the evaluation and selection process in which uncertainty plays a major role. A hybrid model, composed of the analytic hierarchy process (AHP) and Bayesian belief network (BBN), is proposed to evaluate and rank various COTS candidates while explicitly considering uncertainty. Several input parameters such as weights assigned to evaluation criteria, relative scores for various COTS candidates, and prior belief about the satisfaction of various attributes associated with the evaluation criteria need to be estimated. The estimation process of these input parameters is subject to uncertainty that limits the applicability of the modelpsilas results. In this paper, we apply sensitivity analysis to check the validity and robustness of the model. Further, we apply tradeoff analysis to explore the impact of relaxing one criterion in order to achieve an increase in another criterion that is considered as more desirable in a particular project context. A digital library system is used as a case study to illustrate how the proposed tradeoff and sensitivity analysis was performed.
Keywords :
belief networks; decision making; sensitivity analysis; software engineering; software packages; Bayesian belief network; analytic hierarchy process; commercial off-the-shelf products; evaluation criteria; sensitivity analysis; tradeoff analysis; Bayesian methods; Computer science; Conferences; Drives; Performance analysis; Robustness; Sensitivity analysis; Software libraries; Software quality; Uncertainty; Analytic Hierarchy Process; Bayesian belief networks; Commercial Off-the-Shelf (COTS); Sensitivity analysis; Tradeoff analysis; Uncertainty;
Conference_Titel :
Engineering of Computer Based Systems, 2009. ECBS 2009. 16th Annual IEEE International Conference and Workshop on the
Conference_Location :
San Francisco, CA
Print_ISBN :
978-0-7695-3602-6
DOI :
10.1109/ECBS.2009.47