Title :
MRI-compatible ultrasound heating system with ring-shaped phased arrays for breast tumor thermal therapy
Author :
Hung-Nien Chen ; Guan-Ming Chen ; Bo-Sian Lin ; Pi-Hsien Lien ; Yung-Yaw Chen ; Gin-Shin Chen ; Win-Li Lin
Author_Institution :
Inst. of Biomed. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
Therapeutic ultrasound transducers can carry out precise and efficient power deposition for tumor thermal therapy under the guidance of magnetic resonance imaging. For a better heating, organ-specific ultrasound transducers with precision location control system should be developed for tumors located at various organs. It is feasible to perform a better heating for breast tumor thermal therapy with a ring-shaped ultrasound phased-array transducer. In this study, we developed ring-shaped phased-array ultrasound transducers with 1.0 and 2.5 MHz and a precision location control system to drive the transducers to the desired location to sonicate the designated region. Both thermo-sensitive hydrogel phantom and ex vivo fresh pork were used to evaluate the heating performance of the transducers. The results showed that the ring-shaped phased array ultrasound transducers were very promising for breast tumor heating with the variation of heating patterns and without overheating the ribs.
Keywords :
biological organs; biomedical MRI; biomedical transducers; biothermics; hydrogels; phantoms; tumours; ultrasonic therapy; ultrasonic transducer arrays; MRI-compatible ultrasound heating system; breast tumor heating; breast tumor thermal therapy; ex vivo fresh pork; frequency 1.0 MHz; frequency 2.5 MHz; heating patterns; heating performance; magnetic resonance imaging; organ-specific ultrasound transducers; power deposition; precision location control system; ring-shaped ultrasound phased-array transducer; therapeutic ultrasound transducers; thermosensitive hydrogel phantom; Heating; Phantoms; Phased arrays; Transducers; Tumors; Ultrasonic imaging;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6610353