DocumentCode :
3200177
Title :
A practical comparison of Copper Bromide Laser for the treatment of vascular lesions
Author :
Sunwoo Lee ; TaeBum Lee ; HoYoun Kim ; Jungsoo Kim ; HyeJun Eun ; RyunKyung Kim
Author_Institution :
Bison Med. Co., Ltd., Seoul, South Korea
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
3765
Lastpage :
3768
Abstract :
The recent rapid growth in demand for aesthetic non-invasive laser treatments such as unwanted skin rejuvenation, removal of age-related vascular blemishes has led to a boom in the medical devices to treat these conditions. Among diverse laser for skin treatment, copper bromide laser is a very effective, safe, and well tolerated treatment for facial telangiectasia at various energy levels and the most important thing of the copper bromide laser device is that the stability of the energy. However there is no evidence about effective copper bromide laser´s energy level for the treatment of vascular lesions. We compared energy stability and treatment performance between two energy levels in 2W and 8W which commonly use in laser treatment for the vascular lesions. 8W copper bromide laser was more stable compared than 2W copper bromide laser. Also, 8W copper bromide laser was effectively superior to 2W copper bromide laser in treatment of vascular legion. Consequently, 8W copper bromide laser treatment for vascular lesion might be more suitable than 2W copper bromide laser.
Keywords :
laser applications in medicine; radiation therapy; skin; aesthetic noninvasive laser treatment; age-related vascular blemish removal; copper bromide laser device; effective copper bromide laser energy level; energy stability; facial telangiectasia treatment; medical device; power 2 W; power 8 W; skin treatment; treatment performance; unwanted skin rejuvenation; vascular lesion laser treatment; Copper; Electron tubes; Fiber lasers; Laser applications; Laser stability; Power lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610363
Filename :
6610363
Link To Document :
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