DocumentCode
3200301
Title
Improved open circuit voltage in CuInS2-based solar cells
Author
Braunger, D. ; Dürr, Th ; Hariskos, D. ; Köble, Ch ; Walter, Th. ; Wieser, N. ; Schock, H.W.
Author_Institution
Inst. fur Phys. Elektronik, Stuttgart Univ., Germany
fYear
1996
fDate
13-17 May 1996
Firstpage
1001
Lastpage
1004
Abstract
The conversion efficiency of thin film solar cells based on CuInS 2 (η=12%) is mainly limited by a moderate open circuit voltage (≈720 mV). This limitation can be overcome by modifying the absorber/buffer interface leading to open circuit voltages exceeding 800 mV. The addition of ZnS to the CuInS2 as well as adjusting the preparation conditions for the CdS-buffer leads to an increased V oc. The coevaporation of ZnS or CdS additives and diffusion from precursor layers for two types of fabrication processes has been examined: codeposition of the elements and diffusion of Cu and S into In xSy layers. The addition of ZnS leads to Zn-rich segregations on the CuInS2 surface. No shift of the bandgap due to the Zn incorporation could be measured. Additionally, an improved sulfur incorporation using the binary In2S3 as the In and S source was found
Keywords
cadmium compounds; copper compounds; diffusion; indium compounds; semiconductor growth; semiconductor thin films; solar cells; ternary semiconductors; vapour deposited coatings; zinc compounds; 12 percent; 720 mV; CdS; Cu diffusion; CuInS2; CuInS2 surface; CuInS2-based solar cells; In2S3; InxSy layers; S diffusion; Zn-rich segregations; ZnS; absorber/buffer interface; bandgap; codeposition; coevaporation; conversion efficiency; diffusion; fabrication processes; open circuit voltage improvement; precursor layers; sulfur incorporation; thin film solar cells; Chemical processes; Circuits; Electric breakdown; Fabrication; Grain boundaries; Photonic band gap; Photovoltaic cells; Surface treatment; Voltage; Zinc compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
Conference_Location
Washington, DC
ISSN
0160-8371
Print_ISBN
0-7803-3166-4
Type
conf
DOI
10.1109/PVSC.1996.564300
Filename
564300
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