Title :
Nanoporous interconnects
Author :
Oppermann, Hermann ; Dietrich, Lothar ; Klein, Matthias ; Wunderle, Bernhard
Author_Institution :
Fraunhofer IZM, Berlin, Germany
Abstract :
Nanoporous gold bumps have been deposited on silicon wafers by electroplating a silver-gold alloy followed by etching the silver. An open-porous cellular structure of gold at meso-scale is left on top of the bumps. For flip chip bonding we found low temperature and low force bonding conditions. The porous interconnects have very promising properties, like compressibility and reduced stiffness, which should result in higher bond yield and extended reliability.
Keywords :
electroplating; gold alloys; integrated circuit interconnections; nanoporous materials; silver alloys; wafer bonding; AgAu; electroplating; flip chip bonding; force bonding condition; nanoporous gold bumps; nanoporous interconnect; open porous cellular structure; silicon wafers; silver etching; silver-gold alloy; Bonding; Fires; Jamming; Materials;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5643002
