• DocumentCode
    3200551
  • Title

    Using process dissection to achieve design for manufacturability for electronic assemblies

  • Author

    Marcoux, Phil

  • Author_Institution
    PPM Associates, Sunnyvale, CA, USA
  • fYear
    1989
  • fDate
    25-27 Sep 1989
  • Firstpage
    126
  • Lastpage
    128
  • Abstract
    A DFM (design for manufacturability) concept called PPM dissection that uses the assembly defect rates in p.p.m.´s from measurements of variables controllable in the design phase is described. The material presented is on a most basic level, i.e. without the extensive equations and algorithms that make it work. A simple example is presented
  • Keywords
    design engineering; electronic equipment manufacture; PPM dissection; assembly defect rates; design for manufacturability; electronic assemblies; Assembly; Costs; Design for manufacture; Electronics packaging; Equations; Manufacturing processes; Process control; Product design; Surface-mount technology; US Department of Energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/EMTS.1989.68965
  • Filename
    68965
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3200551