Title :
Using process dissection to achieve design for manufacturability for electronic assemblies
Author_Institution :
PPM Associates, Sunnyvale, CA, USA
Abstract :
A DFM (design for manufacturability) concept called PPM dissection that uses the assembly defect rates in p.p.m.´s from measurements of variables controllable in the design phase is described. The material presented is on a most basic level, i.e. without the extensive equations and algorithms that make it work. A simple example is presented
Keywords :
design engineering; electronic equipment manufacture; PPM dissection; assembly defect rates; design for manufacturability; electronic assemblies; Assembly; Costs; Design for manufacture; Electronics packaging; Equations; Manufacturing processes; Process control; Product design; Surface-mount technology; US Department of Energy;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
DOI :
10.1109/EMTS.1989.68965
