• DocumentCode
    3200552
  • Title

    The cubic spline interpolation of a standing wave envelope

  • Author

    Couture, S. ; Beal, J.C. ; Antar, Y.M.M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
  • fYear
    1992
  • fDate
    18-25 June 1992
  • Firstpage
    196
  • Abstract
    It is shown that exploiting the smooth behavior of the standing-wave´s envelope near maxima yields better results in impedance and return loss computations. The improvement is achieved using a very simple algorithm to locate extrema in an envelope approximated by a cubic spline and without increasing the order of the moment matrix. The method consists of interpolating the continuous standing wave envelope by a cubic spline. The fit of a spline depends on the amount of discrete data points per wavelength and on the true shape of the envelope. An increase in the number of data points, or knots, along the feedline improves the fit of a spline, but at the cost of an increase in the order of the moment matrix. The objective is to obtain a satisfactory representation of the envelope with as few discrete data points along the feedline as possible. Based on the results, it appears that, for arbitrary values on the standing wave ratio, the cubic spline interpolation of maxima is more reliable than that of minima.<>
  • Keywords
    electric impedance; interpolation; losses; splines (mathematics); waveguide theory; SWR; algorithm; cubic spline interpolation; feedline; impedance; moment matrix; return loss; standing wave envelope; standing wave ratio; wavelength; Educational institutions; Impedance; Interpolation; Measurement techniques; Meter reading; Microstrip; Military computing; Moment methods; Reflection; Spline;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE
  • Conference_Location
    Chicago, IL, USA
  • Print_ISBN
    0-7803-0730-5
  • Type

    conf

  • DOI
    10.1109/APS.1992.221968
  • Filename
    221968