• DocumentCode
    3200614
  • Title

    Effect of Mg doping on increase in the life with low contact resistance of Ag-Pd alloy switching contacts in silicone vapor environments

  • Author

    Tamai, Terutaka ; Sato, Akihiro ; Ito, Syuro

  • Author_Institution
    Electron. Inst., Hyogo Univ. of Teacher Educ., Japan
  • fYear
    1999
  • fDate
    4-6 Oct. 1999
  • Firstpage
    31
  • Lastpage
    36
  • Abstract
    When silicone vapor which adsorbed on contact surfaces is subjected to high temperature due to electric discharge in the atmosphere, SiO/sub 2/ is formed by chemical decomposition of the adsorbed silicone molecular. When SiO/sub 2/ is formed on contact surfaces and is caught in the interface of contacts, contact failure is caused by an insulation property of SiO/sub 2/. Newly developed contact material of Ag(40wt%)-Pd(60wt%) alloy with a small amount dopant of Mg was applied experimentally to a micro relay. This material shows remarkable improvement of contact resistance property for contaminant oxide film in comparison with usual Ag-Pd contacts. In this study, the contact resistance property for the number of make-break switching operations of the Ag-Pd-Mg alloy was examined by wide range electrical conditions under saturated (1300 ppm) silicone vapor. Obtained contact resistance properties were compared with the Ag-Pd alloy itself and Ag-Pd overlaid with Au(90wt%)-Ag(10wt%) which is used usually. As results, prolonged low contact resistance property of the Ag-Pd-Mg alloy for silicone environment was found. The mechanism of the low contact resistance property was clarified by cleaning effect based on removal of powder products formed from the contact traces.
  • Keywords
    contact resistance; electrical contacts; magnesium alloys; palladium alloys; relays; silicones; silver alloys; surface contamination; Ag-Pd alloy switching contact; Ag-Pd-Mg; Mg doping; SiO/sub 2/ contamination; chemical decomposition; contact failure; contact resistance; electric discharge; life; micro-relay; silicone vapor environment; surface adsorption; Atmosphere; Chemicals; Contact resistance; Doping; Insulation; Mechanical factors; Microrelays; Silicon alloys; Surface discharges; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1999. Proceedings of the Forty-Fifth IEEE Holm Conference on
  • Conference_Location
    Pittsburgh, PA, USA
  • Print_ISBN
    0-7803-5549-0
  • Type

    conf

  • DOI
    10.1109/HOLM.1999.795925
  • Filename
    795925