• DocumentCode
    3200658
  • Title

    Local stress measurement methods for packaging purposes- A comparison

  • Author

    Gollhardt, Astrid ; Vogel, Dietmar ; Michel, Bernd

  • Author_Institution
    Micro Mater. Center Berlin, Fraunhofer IZM, Berlin, Germany
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The paper gives a brief overview on some advanced stress measurement methods, which permit local access to semiconductor or packaging structures with a micrometer scale spatial resolution. Focusing is made on local stress relief, Raman spectroscopy and EBSD based techniques. The methods are compared with respect to their resolution limits, feasibility to be applied to different materials and their specific limitations.
  • Keywords
    Raman spectroscopy; electronics packaging; stress measurement; EBSD based techniques; Raman spectroscopy; local stress measurement methods; local stress relief; micrometer scale spatial resolution; packaging purposes; semiconductor structures; Manufacturing; Stress measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5643016
  • Filename
    5643016
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3200658