DocumentCode
3200844
Title
Simulations of transient thermal and electrical behavior of contact spots
Author
Öberg, Åke ; Isberg, Jan ; Olsson, Karl-Erik
Author_Institution
ABB Corp. Res., Vasteras, Sweden
fYear
1999
fDate
4-6 Oct. 1999
Firstpage
141
Lastpage
145
Abstract
The problem of the influence of transient current pulses on the physical conditions in electrical contacts has been addressed by conducting simulations of the coupled thermal and electrical response of contact spots of two different sizes to transient currents. For this purpose, we have used SPECTRUM; a multi-physics finite element method package capable of handling coupled nonlinear thermal and electrical 3D systems. From the simulations, we see that the uniform temperature distribution in the steady state case is not preserved when subjecting the contact to a transient current, but instead the temperature is elevated around the rim of the spots. Also, a smaller spot becomes substantially hotter than a larger spot, and could therefore be expected to grow and age faster, although this hypothesis is not proven experimentally in the present study.
Keywords
electrical contacts; finite element analysis; temperature distribution; transient analysis; SPECTRUM; contact spots; multi-physics finite element method package; physical conditions; transient electrical behavior; transient thermal behavior; uniform temperature distribution; Contacts; Copper; Couplings; Nickel; Packaging; Resistance heating; Steady-state; Temperature dependence; Temperature distribution; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 1999. Proceedings of the Forty-Fifth IEEE Holm Conference on
Conference_Location
Pittsburgh, PA, USA
Print_ISBN
0-7803-5549-0
Type
conf
DOI
10.1109/HOLM.1999.795940
Filename
795940
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