• DocumentCode
    3200844
  • Title

    Simulations of transient thermal and electrical behavior of contact spots

  • Author

    Öberg, Åke ; Isberg, Jan ; Olsson, Karl-Erik

  • Author_Institution
    ABB Corp. Res., Vasteras, Sweden
  • fYear
    1999
  • fDate
    4-6 Oct. 1999
  • Firstpage
    141
  • Lastpage
    145
  • Abstract
    The problem of the influence of transient current pulses on the physical conditions in electrical contacts has been addressed by conducting simulations of the coupled thermal and electrical response of contact spots of two different sizes to transient currents. For this purpose, we have used SPECTRUM; a multi-physics finite element method package capable of handling coupled nonlinear thermal and electrical 3D systems. From the simulations, we see that the uniform temperature distribution in the steady state case is not preserved when subjecting the contact to a transient current, but instead the temperature is elevated around the rim of the spots. Also, a smaller spot becomes substantially hotter than a larger spot, and could therefore be expected to grow and age faster, although this hypothesis is not proven experimentally in the present study.
  • Keywords
    electrical contacts; finite element analysis; temperature distribution; transient analysis; SPECTRUM; contact spots; multi-physics finite element method package; physical conditions; transient electrical behavior; transient thermal behavior; uniform temperature distribution; Contacts; Copper; Couplings; Nickel; Packaging; Resistance heating; Steady-state; Temperature dependence; Temperature distribution; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1999. Proceedings of the Forty-Fifth IEEE Holm Conference on
  • Conference_Location
    Pittsburgh, PA, USA
  • Print_ISBN
    0-7803-5549-0
  • Type

    conf

  • DOI
    10.1109/HOLM.1999.795940
  • Filename
    795940